Mobius Photonics acquires Harvard UV laser sources license
Mobius Photonics Inc. has entered into an exclusive licensing agreement with Harvard University regarding United States patent #5,745,284, which broadly covers UV laser sources based on the harmonic wavelength conversion of the output of a seeded amplifier, particularly a fibre amplifier. The patent is based on the pioneering work of Lew Goldberg, Dahv Kliner, and Jeffrey Koplow.
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Dr. Laura Smoliar, CEO of Mobius Photonics, Inc., said, "Because of the telecom bubble, the technology described in this patent lay dormant for years, but it is now commercially viable. Mobius has implemented it in products that allow laser-based manufacturers to meet the demands of higher throughput, higher quality, smaller features size, and more compact packaging. Mobius delivers commercial light sources, including UV sources, based on fibre amplifiers. Acquisition of an exclusive license to this patent enhances the value of Mobius products and increases our customers' competitive advantage in the marketplace."
"We are pleased to reach this licensing agreement with Mobius Photonics," stated Alan Gordon, of the office of technology development, Harvard University. "Our agreement with Mobius is aligned with our goal of fostering commercialisation of U.S. government funded research."
Founded in 2005, Mobius Photonics, Inc. says it is the leader in commercial fibre-based laser sources for the visible and UV. Mobius is made up of industry veterans who previously created two successful laser companies, a management team that combines in-depth understanding of customer needs with manufacturing experience, and a product development team that pushes the state of the art by working in close collaboration with suppliers and customers from around the world.
Current products feature both fundamental (IR) and harmonically wavelength converted (green and UV) outputs. These products are based on a pulsed master-oscillator, fiber-power-amplifier (MOFPA) architecture. Applications for these laser sources include wafer singulation, material processing, semiconductor inspection and repair, via drilling, and medical therapy.
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© Chilli Publishing Ltd 2008 |
24 JAN 2008 |
